New features from EDWinXP ver 1.50 to EDWinXP 1.61

What’s new in EDWinXP 1.50

Following release of previous version, several new features and improvement to existing features have been implemented in EDWinXP 1.50

PCB Layout Design and Fabrication

1. Copper pour connectivity test have been added PCB Layout Editor. Similar test was already included in Fabrication Manager. The advantage of this test in Layout Editor is that the connectivity may be checked while the board layout is designed. In both modules, the test may be now performed in selectable accuracy of 0.100, 0.050 and 0.025 mm. The time needed to execute the connectivity test has very significantly reduced.
2. Polygon shapes for copper removal introduced in 1.40, allowed to add feature that automatically removes unnecessary copper in isolated places within copper pour areas. This function was available for 1.40 users through live update. In 1.50, it has been improved in both speed (about 50% reduction of execution time) and accuracy.
3. Gerber View feature has been improved in order to reduce number of selections necessary to pre-process and display artworks in Gerber formats.
4. The option to plot inverted polarity circles and squares in size of pinholes for PMD component and vias has been added for Gerber format output. This option is available for in RS-274-X format only.
5. Settings for all fabrication exports (GenCAM, IDF and newly added Valor’s ODB++ format) have been grouped in common dialog within Fabrication Manager.
6. It is now possible to import projects from other EDA packages in ODB++ format
7. Reconstruction of projects from Gerber format artworks been have significantly improved by adding feature for rebuilding component parts and packages from imported graphics. Projects can be now completely reconstructed even if necessary library elements are not available.
8. Number of tools for automatic routing of connection in PCB Layout Editor has been increased. It is now possible to automatically connect two separate trace branches of a net, re-route connections for a group of relocated components, route lead-out traces from pins of component with complicated pad patterns, automatically miter traces and remove redundant via holes.
9. Online clearance check has been introduced with improved visibility for detected clearance violations.
10. It is now possible to display ratsnest in two modes: will all nodes or with unconnected nodes only.
11. Important function “re-route” trace may be now performed in two modes: “re-route trace segment” and “re-route pin to pin connection. This latter is particularly useful when cleaning up design after auto-routing.
12. Node marker size (squares) and pin entry marker size (crosses) are automatically adjusted to the pitch of component pads in order to ensure best visibility. Similarly, via hole marker size is automatically adjusted to smallest hole diameter in via pad stacks

Schematic Capture and Simulation

1. New feature called Filter Designer has been added. The system library includes prototype circuits for active low-pass, high-pass, band-pass and band-stop filters. Filter Designer allows to select one of the variants of those filters (Chebyshev, Butterworth, Bessel, Elliptic (Cauer) or Universal) and specify required filter output parameters – frequency and quality range. The parameters (capacitance and resistance) for filter circuit components are calculated and updated in the circuit, which subsequently may be appended to the project.
2. It is now possible to convert functional descriptions of discrete parts, expressed in form of SPICE format sub-circuit into analogue model for Mixed Mode Simulator.
3. Following code models have been added to MM Simulator and EDSPice model libraries:
4. New feature called Filter Designer has been added. The system library includes prototype circuits for active low-pass, high-pass, band-pass and band-stop filters. Filter Designer allows to select one of the variants of those filters (Chebyshev, Butterworth, Bessel, Elliptic (Cauer) or Universal) and specify required filter output parameters – frequency and quality range. The parameters (capacitance and resistance) for filter circuit components are calculated and updated in the circuit, which subsequently may be appended to the project.
5. It is now possible to convert functional descriptions of discrete parts, expressed in form of SPICE format sub-circuit into analogue model for Mixed Mode Simulator.
6. Following code models have been added to MM Simulator and EDSPice model libraries:

EDSPICE code models	MM Simulator models
M7218CD	DAC0800
Max456	ADC0800
Max4587	MAX232
Max522	DAC AD 569
max5341	HPDL1414
max5352	ULN2003A
max625	Stepper Motor
max690	Potentiometer
max691	LCD Display
max696	LCD Display Driver-HD44780U
max697	SweepGenerator.dll
max697	SweepGenerator.dll
max701
max702
max708
max7225
MAX7240

7. EDSPICE updates for EDWinXP 1.50

Sub-circuit files

• Diac
• CCCS
• CCVS

Circuit files (SPICE netlist format)

• BUCK CONVERTER AC MODEL.CIR
• DC_MOTOR_MODEL.CIR
• TREBLE AND BASS TONE CONTROLS.CIR
• I-TO-V CONVERTER (TRANSIMPEDANCE AMP).CIR
• CCCS.CIR

Sample projects with new EDSPICE sub-circuits

• 7805 Regulator - voltage regulator 7805
• CENTRE TAPPED TRANSFORMER - transformer
• Controlled Full Wave Rectifier - SCR
• OPTOCOUPLER- OPTOCOUPLER
• IGBT - IGBT
• Sidac characteristics - sidac
• UJT Relaxation Oscillator – UJT
• Current Controlled Current Source - CCCS
• Current Controlled Voltage Source – CCVS

Updates in Part Libraries

PART	MANUFACTURER	SYMBOL	PACKAGE
0805AS-2N7M-01	Fastron	INDUCTOR	L/L70/SM
59S101-400E3	Rosenberger	CONN	CON/F5/A
74HC4052D	Philips	MUX4052	SOIC16/150
8516-4500	3M Interconnect Solutions	CONN	CON/HEADER16/A
8520-4500	3M Interconnect Solutions Division	CONN	CON/HEADER16/A
8526-4500	3M Interconnect Solutions Division	CONN	CON/HEADER16/A
8540-4500	3M Interconnect Solutions Division	CONN	CON/HEADER16/A
8560-4500	3M Interconnect Solutions Division	CONN	CON/HEADER16/A
A3953SB	Allegro	DRV3953	DIP16/300
ACSL-6400-T	Agilent Technologies	OPTO6400	SOIC16/150
ADF7020BCPZ1	Analog Devices	TxRx7020	LCC48/A
AT91SAM7S64	Atmel	MICR91SAM7S	QFP64/D
ATmega128L-8MC	Atmel	MICR128	LCC64
bq24022DRC	Texas Instruments	ADPTR24022	LCC10
BSP742T	Infineon technologies	SWT742	SOP8/150
C-551SR	Para Light	DISP5503	DIP10/600
CY8C27443-24PXI	Cypress	MCNTRLR8C27443	DIP28/300
DB15SRT/3R	Amphenol	CONN	CON/DB15/D
DCP010515DBP-U	Burr-Brown	DCP0105D	DIP14/300/P7
DS1822	Dallas Semiconductor	THERMO1822	TO92/3
dsPIC30F5011	Microchip	CNTRLR30F5011	QFP64/C
dsPIC30F6011	Microchip	CNTRLR30F6011	QFP64/C
dsPIC30F6014	Microchip	CNTRLR30F6014	QFP80/B
EP2C8F256	Altera	FPGA8C256F	BGA256/e40
F3345	FOX Electronics	XTALOSC1	DIP4/SM/3
FDC6301N	Fairchild	PFET_DG	SOT23/6
FDV303N	Fairchild	NFET_DG	SOT23/3
FSA4157P6	Fairchild	SPDT4157	SC88
G5V-2	OMRON	RLY1FORMC,RLY1FORM	DIP16R/8
GM5WA06260A	SHARP	LED	DIP6/SM
L5973D	ST Micro Electronics	VREG5973	SOP8/150
L6203	ST Micro Electronics	DRV6203	TO220/11
LAN91C111	SMSC	LAN91C111	QFP128/C
LATBT66C	OSRAM	3DIODE	DIP4/SM/B
LPC2106FBD48	Philips	MCNTLR2106	QFP48
LZ-12VM	FUJITSU	RLY1FORMC	DIP5
M54562FP	Mitsubishi	DARARRAY54562	SOP20/200/A
MAX5400EKA-T	Maxim	DPOT5400	SOT23/8
MAX952ESA	Maxim	AMPR952	SOIC8/150
MC6802P	Motorola	MICR6802	DIP40/600
MC6821P	Motorola	ADAPTR6821	DIP40/600
MCF5235CVM100	Freescale	MICR5235	BGA256/e40
MIC2941ABU	Micrel	VREG2941	TO263/5
MM5450BN	Micrel	DRV5450	DIP40/600
MMA7260Q	Freescale	ACCLR7260	QFN16
MSC1202Y2RHHR	Texas Instruments	ADC1202	LCC36/A
nRF905-EVKIT 868/915	NORDIC	TxRx905	LCC32/A
PIC16F688I/SN	Microchip	MCNTLR16F688	SOIC14/150
PIC16F876/SO	Microchip	MICR16F873	SOIC28/300
PIC18F4220-I/P	Microchip	MCNTRLR18F4220	DIP40/600
PIC18F452-I/P	Microchip	MCNTLR18F442	DIP40/600
PIC18F452-I/PT	Microchip	MCNTLR18F442	QFP44/C
PIC18F4550	Microchip	MCNTRLR18F4550	DIP40/600
PIC18F458-E/L	Microchip	MCNTRLR18F458	LCC44
QMB-111PC	Star	BUZZER	PMD2/e12
QT1080-ISG	Quantum	SENSOR1080	LCC32/A
RY-12	FUJITSU	RLY1FORMC,RLY1FORM	DIP16R/8
TA7252AP	Toshiba	AMP7252	SIP7/A
TDA7294V	ST Micro Electronics	AMP7295	TO220/15
TEL3-2422	Traco	CONV2422	DIP14/400/8
TLE5205-2GP	Infineon technologies	BRIDGE5205	SOP20/425
TLE6228GP	Infineon technologies	SWT6228	SOP20/425
TLE6232GP	Infineon technologies	SWT6232	SOP36/400
TLMK330	Vishay	LED	LCC2
TMP36FS	Analog Devices	SESOR36	SOIC8/150
UC3906DW	Texas Instruments	ADPTR3906	SOIC16/300
ULN2004D	ST Micro Electronics	DARARRAY2003	SOIC16/150
XC9572	Xilinx	PLD9572	LCC44
TJA1040	PHILIPS	CANCNTR1040	SOIC8/150
LM317AMDT	NATIONAL	ADVOLTREG	TO252/C
FT232RL	FTDI Chip	UART232A	SOP28/200
2SA933AS	Rohm	PNP	TO202/3/B
2SC174S	Rohm	NPN	TO202/3/B
HD44780UA00TF	HITACHI	DISPCNTRLR44780	TQFP80
HD44780UA02TF	HITACHI	DISPCNTRLR44780	TQFP80

Symbol only parts

Part Name	Symbol
ANTENNA	Close
BUZZER	Close
CAVITYRESONATOR	Close
CIRCUITBREAKER	Close
COAXIALJACK	Close
CRO	Close
EARPHONE	Close
GALVANOMETER	Close
GUNNDIODE	Close
LAMP	Close
LASERDIODE	Close
LDR	Close
MICROPHONE	Close
MOTOR	Close
OHMMETER	Close
PHONEJACK	Close
PHOTODIODE	Close
PHOTOFET	Close
PHOTOVOLTAICCELL	Close
SCHOKELYDIODE	Close
STEPPERMOTOR	Close
THERMOCOUPLE	Close
TRIMMERCAPACITOR	Close
TUNNELDIODE	Close
VARACTORDIODE	Close
VARIABLECOIL	Close
WATTMETER	Close

What is New in EDWinXP 1.60 and EDWinXP 1.61

Project Version Control
Project version control enables storing of different versions of a project in the same disk file. Current version may be saved at any time and all saved versions become part of the same project database. Any saved version may be restored immediately and set as current.

Since all recorded versions are included in the same database and are loaded from and stored in a single common disk file, there is no need to keep track of different version files and worrying about backups. It would be enough to back up only one file containing all recorded versions. It also allows to reconstruct single project database with several versions that were stored as separate database files (.epb) in previous versions of EDWinXP. There are provisions to view general and statistics information’s and also to compare selected version with the active version.

The new structure of database makes it incompatible with previous version of EDWinXP. Older project are fully upward compatible, can be loaded and will be automatically converted to the new format. There is also possibility to save selected project versions in a separate file in the format accepted by older releases of EDWinXP.

Note: This feature is available only for EDWinXP Professional.

Layout Editor

Trace Length and Width Trimming

This feature allows inserting pattern of segments into selected trace in order to obtain exact specified length. The shape of the pattern, its amplitude and step length may be set as parameters for calculation of necessary number of steps. All user has to do is to select the suitable point in the trace where the pattern should be inserted. This is done interactively – the pattern (generated according to currently set parameters) is visible and follows cursor while it is moved along the trace. Parameters may be adjusted during this time until permanent insertion is confirmed by the mouse click.



Trimming function works in three modes: trimming single trace to specified length, trimming two traces to the length of longer one and trimming net connection to specified length. In the latter mode, it is possible to see how changing of length and average trace width affects net’s electrical properties (resistance, capacitance, inductance and impedance)

As further requested improvement, the current trace length is dynamically calculated while trace is manually routed or re-routed.

Automatic correction of selected clearance errors

Reporting of clearance errors have been improved by providing additional details of detected conflicts. The dialog presenting locations of conflicts is always visible (modal) while navigating from error to error. Focused errors are distinctly marked for exact identification.


Another new feature is automatic correction of selected clearance error. This function works in two modes. Error to correct may be selected by pointing corresponding marker on the screen. The program is now able to recognize exactly which traces are in conflict. The one that creates most conflicts is automatically rerouted. In other mode, the user may select any of conflicting traces and order its automatic rerouting.

Automatic clearance correction after routing and rerouting

In version 1.61, the on-line clearance check feature has been strongly enhanced by automatic correction of all clearance errors caused by the last route or reroute operation. This function has several options. It may be specified that correction should be executed always when error are detected without asking. Alternatively, information that errors have been detected is displayed awaiting confirmation for executing correction. It is also possible to order that correction should apply to the last routed/rerouted trace or that this trace must be left unchanged and only other conflicting traces should be automatically rerouted.

Automatic “trace project” feature

Pressing key combination, Shift A when a trace is manually routed or rerouted activates and deactivates automatic “trace project” function. Following happens, depending on currently executed operation:

• When a new trace is created and the function is ON, the program automatically routes clearance error free connection from the last inserted point to current cursor position. Cursor movement changes this so-called “trace project” to reroute dynamically depending on obstacles encountered on the way. Mouse click confirms that trace project to this point is accepted and subsequent trace project starts to be routed from this point. Even if the route suggested by trace project is not accepted, the feature may be used to seek best way for manual routing. It is possible to alternate (by Shift A) between the modes and route some parts of the trace manually and some parts automatically.

• When a trace point or segment is relocated, and the automatic trace project function is ON, the program reroutes preceding and following segments of the trace, starting in both directions from current cursor position. Using option “rip-up before reroute” allows in this case rerouting of entire connection between two nodes

Project trace is routed according to design rules and auto-routing parameters currently set for the net.

Often requested, so-called “XORE-ed” display of traces has been implemented in 1.61 release. In the new version, the display color changes in places where traces on different layers crisscross or overlap, creating effect of “transparency”.
There is also a new mode for displaying connections – Trace Frames mode. This mode when switched ON produces two effects depending on whether the layout is displayed in True Size or Centerline mode. Screen shots below present same area of the board displayed respectively in Centerline and True size modes and with Trace Frames mode set to ON. The traces are visualized by their contours allowing accessing their actual width and simultaneously to “see through” traces on all layers.





The transparency due to “XORed” trace display is clearly visible on the picture above showing True Size mode view. Trace Frames mode produces in this case small reddish circles representing position of bending points. This feature helps in detecting redundant bending points (inserted often by careless manual routing) that create unnecessary collinear trace segments

According to the same rule, oval pads created from lines of certain length and with are presented in contoured form that allows seeing their real size outlines in Centerline view mode with Pad Frames ON.



On users’ request, Padstack Creation Wizard has been equipped with possibility to create rectangular SMD pads with rounded corners). Other issue connected to padstacks that has been solved in this version is the possibility to create SMD pads on top and bottom layers. Check for connectivity in Layout Editor that did not allow connection of trace to bottom placed pad in a component placed on top layer has been accordingly changed. This especially makes creating of packages representing finger connectors easier and more straightforward.

Shortcut to copper check added to flood test in Layout Editor

The flood test for copper pour connectivity that has been implemented in previous version has been enhanced to include also shortcut check. In this manner, all layout design testing functions are finally grouped in one application.

More padstacks for via holes

Number of available padstacks for via holes (previously 7) has been increased to 16. To facilitate differentiation among various padstacks, it is now possible to add labels to each of them for individual recognition. It is even possible to highlight vias using given type of padstack.

Library Editor

Auto dimensioning of packages and padstacks

Users who produce boards on order often need to document library elements created for each design, even in printed form. For this purpose, dimensioning of packages and padstacks has been implanted in version 1.61. Tables with dimensioning data in following form are created fully automatically after switching to this mode while editing packages in Library Editor or viewing them in Package Viewer:

List of Material Editor

This module has been replaced by completely rewritten new version that on one hand allows creating simple lists much easier and on the other allows using advanced feature of External Info Database in more straight forward, intuitive way. Additionally, output filters have been introduced enabling to generate variants of BOMs from the same project database.

Fabrication Manager

• Undo/Redo feature is implemented, which is especially needed when reconstructing projects from graphic imports.
• Introduced simple means for aligning images.
• New fabrication export has been implemented, this time for exporting CNC data in G-CODE format containing generic machining program for cutting board outline contours and internal cutouts. Toolpath for cutting are also calculated allowing for specified cutter diameter (cutting outside outer contour and cutting inside internal outlines).

Mixed Mode Simulator

As a complement to previously released development kit for PIC16C family of microcontrollers, with 1.61 we are releasing similar kit for PIC16F84/C84 family containing C-compiler, Assembler, Debugger and instructive application examples.
New microcontroller kit and simulation models

• New models created in MMI technology for:
• Line 5 x 8 dots LCD display full version
• HD44780U LCD display driver full version
• Line 5 x 8 dots LCD display
• Line 5 x 10 dots LCD display
• Voltmeter (instrumental)
• GLED
• OrLED
• Standard digital models:
• 74F579-8-bit bidirectional binary counter (3-State)
• 74F597-8-bit shift register with input flip-flops

Mouse wheel

Support for mouse wheel has been fully implemented in version 1.60. The wheel is used for zooming graphic display in and out with simultaneous panning to point shown by the cursor. Mouse wheel may be also used to scrolling up and down the tables (grid control) that are displayed in pop up dialogs

Vista compatible help system

All help files have been converted and re-edited for compatibility with Microsoft Vista operating system

Many small improvements

Many requested small improvements have been added to the system and not all of them are clearly visible. Just to mention a few:

• ALT key to initiate entering of shortcut commands. This has been added for improved ergonomics.
• Provision to see total design time in project properties.
• Long cursor feature in wave form viewer.
• List of recently opened projects has been increased to 8 in project explorer's File option.
• Content of data created by List Generator program has been extended to include component values.
• Measurement function recognizes more object types (board outline) and displays not only distance but also delta X and delta Y between measured objects.
• Nodes in Net Property dialog (Schematics Editor) are displayed grouped by schematic pages where they are located.
• Pins numbers in Component Property (Layout Editor) dialog are displayed with corresponding schematic entry names
• Refreshing of elements in Project Library may be done selectively.
• Opening of padstack editor may be done directly from Layout Editor.
• Number of groups that can be added at a time is increased to 128.



LIST OF NEW PARTS UPDATED IN EDWINXP 1.61




No.	PART	SYMBOL	PACKAGE
1.	10MQ100N	DIODE	DO214AA/2/L175/B
2.	1-1740194-2	CONN	CON/DB9/SMD
3.	1N4148	DIODE	SOD80/2/L125/A
4.	3296W-1-103LF	RESPOT3296	RTP3
5.	4HEADERL/A	CONN	CON/HEADER4/A
6.	500075-1517	500075-1517	500075-1517
7.	8279	I8279	DIP40/600
8.	A3984SLP-T	DRV3984	SOP24/170
9.	A4983SET-T	DRV4983	LCC28/C
10.	AMP 1-6605834-1	CONNRJ10	CON/RJ45-10
11.	ATmega1281V-8MU	MICR1281	LCC64
12.	ATmega128L-8MC	MICR128	LCC64
13.	ATmega64L-8MC	MICR128	LCC64
14.	ATmega8L-8AC	MCNTLR8L	QFP32
15.	B6TS-04LT	SNSB6TS	SOP20/150
16.	C8051F320	MICR8051320	QFP32/A
17.	C8051F321	MICR8051321	QFN28
18.	C8051F350-GQ	MICR8051350	QFP32/A
19.	C8051F351-GM	MICR8051351	LCC28/C
20.	CC0402	CAP	C/L105/SM
21.	CC0603	CAP	C/L171/SM
22.	CD4098BE	MUL4098	DIP16/300
23.	CLE-115-01-G-DV3	CONN	CON30/SMD
24.	CP1A-12V	RLYCP1A-12V	RELAY4
25.	DM9000E	MACCNTRLR9000	QFP100
26.	ELS-511GWA	LCD511	DIP10/A
27.	eZ80F91AZA50EG	MCNTRLZ809150	QFP144
28.	eZ80F91AZA50SG	MCNTRLZ809150	QFP144
29.	HCNR200-300E	OPTO200	SOIC8/350
30.	HCPL-7800A-300E	AMP7800	SOIC8/250
31.	HEF4049BT	INV	SOIC16/150
32.	HEXFET7507	HEXFET7507	MICRO8
33.	INA196AIDBV	MON196	SOT23/5/A
34.	IRF7507PbF	MOSFET7507	MICRO8
35.	IRFR2407	MOSFET 2407	TO252/2
36.	KLBR4	CONN	CON4
37.	L6229D	DRV6229	SOIC24/300
38.	LM2937-3-3	REG2937	SOT223/4
39.	LM2937IMP	REG2937	SOT223/4
40.	LM3940IMP-33	VOLTREG	SOT223/4
41.	LP2960IM-50	VOLTREG2960	SOIC16/150
42.	LPC2212FBD144	MICR2212	QFP144/C
43.	LPC2212FBD144/00RT	MICR2212	QFP144/C
44.	LPC2214FBD144	MICR2212	QFP144/C
45.	LPC2214FBD144/00	MICR2212	QFP144/C
46.	MAX1241BCPA	ADC1241BCPA	DIP8/300
47.	MAX232CPE	TxRx232	DIP16/300
48.	MAX7301AAI	INTRF7301/A	SOP28/200
49.	MC68HC812A4CPV8	MICR68812	QFP112
50.	MIC24011-0101T-LF3	TRANSMR24011	TFR12/RJ45
51.	MiniDimm200_FCI59355	FINGER	59355
52.	MMA7260QT	ACCLR7260	QFN16
53.	MMC73-105K50K37-TR12	CAP	C/L750/SM
54.	MRF24J40	TRANS2440	QFN40
55.	NEB/J25R	CONN	CON/PWR3/J25R
56.	P89C51RD2BBD/01	i8051/A	QFP44
57.	PIC16F876/SP	MICR16F873	DIP28/300
58.	PIC18F4620	MICR18F4620	QFN44
59.	PWRCON3	CONN	CON/PWR3/B
60.	PWRCON3/A	CONN	CON/PWR3/A
61.	RW0S6BBR010FE	RES	SMD2010
62.	SN75451B	DRV75451	SOIC8/150
63.	SP485CN	TXRX485	SOIC8/150
64.	STR710FZ1T6	MCU71x	QFP144/C
65.	STR710FZ2T6	MCU71x	QFP144/C
66.	STR710FZT6	MCU71x	QFP144/C
67.	TDA8945S	AMP8945	SIL9P
68.	TPMEXXXK	CAP	L/L295/SM
69.	UDN2981A-T	DRV2981	DIP18/300
70.	UDN2982A-T	DRV2981	DIP18/300
71.	Z80	MCNTRLZ80	QFP44C