1. It will be easy for users, if packages of same type come in serial listing.

2. If we keep some information like width, omitted pins etc. in the name, user can easily access the required package in one look.

3. By keeping a naming convention for packages the Library will become more structured and easy to handle.

4. This convention is developed for changing the entire pa ckage name in to a standard form. So the maximum length of the name should be within 15 characters.

By taking this as a basic goal, we have developed a naming convention for packages in our library and it is as follows:

BGA Naming Convention

Structure:	“BGA N/M Matrix/V”
2k Description Structure:	“BGA N/e Pitch/M Matrix”

Eg: BGA352/M26x26

Capacitor Naming Convention

For PMD

Structure for Fixed Capacitor:	“C/L length/V”
2k Description Structure:	“C/L length/H Hole Diameter”

Include all CEF, CEL, CES, CF, CFP, CK, CKR, CL, CSR, CASE etc.
Eg: C/L200, C/L200/A, C/L400.

Structure for Polarized Capacitor:	“C/L length/POL/V”
2k Description Structure:	“C/L length/H Hole Diameter/POL”

Include all CEF, CEL, CES, CF, CFP, CK, CKR, CL, CSR, CASE etc.
Eg: C/L400/POL, C/L400/POL/A.

Structure for Variable Capacitor:	“CVAR N/V”
2k Description Structure:	“CVAR N/H Hole Diameter”

Eg: CVAR3, CVAR3/A


For SMD

Structure for Fixed Capacitor:	“C/L length/SM/V”
2k Description Structure:	“C/L length/S pad size”

Eg: C/L90, C/L133/SM.

Structure for Variable Capacitor:	“CVAR N/SM/V”
2k Description Structure:	“CVAR N/S pad size”

CASE Packages Naming Convention

Structure:	“CASE# /N/V”
2k Description Structure:	“CASE# /N/e Pitch”

EEg: CASE221/3


Connector Naming Convention

General Structure:	“CON/Type N/V”
2k General Description Structure:	“CON/Type N/e Pitch”

Structure for Header Connector:	“CON/HEADER N/V”
2k Description Structure:	“CON/HEADER N/e Pitch”

Eg: CON/HEADER4, CON/HEADER20/A.

Structure for DB Connector:	“CON/DB N/V”
2k Description Structure:	“CON/DB N/e Pitch”

Eg: CON/DB15, CON/DB15/A.

Structure for EURO Connector:	“CON/EURO N/V”
2k Description Structure:	“CON/EURO N/e Pitch”

Eg: CON/EURO64, CON/EURO64/A.

Structure for FRC Connector:	“CON/FRC N/V”
2k Description Structure:	“CON/FRC N/e Pitch”

Eg: CON/FRC10

Structure for IBM Connector:	“CON/IBM N/V”
2k Description Structure:	“CON/IBM N/e Pitch”

Eg: CON/IBM18, CON/IBM18/A

Structure for Power Connector:	“CON/PWR N/V”
2k Description Structure:	“CON/PWR N/e Pitch”

 Eg: CON/PWR10.

Structure for List Connector:	“CON/LIST N/V”
2k Description Structure:	“CON/LIST N/e Pitch”

 Eg: CON/LIST10

Structure for Edge Connector:	“CON/EDGE N/V”
2k Description Structure:	“CON/EDGE N/e Pitch”

Eg: CON/EDGE18


Crystal Naming Convention

For PMD

Structure for Crystal:	“XT/L length/V”
2k Description Structure:	“XT/L length/H Hole Diameter”

Eg: XT/L192

For SMD

Structure for Crystal:	“XT/L length/SM/V”
2k Description Structure:	“XT/L length/S Pad Size”

Eg: XT/L248/SM


DC-DC Converter Naming convention

Structure	“DC N/V”
2k Description Structure:	“DC N/e Pitch/W Width”

Eg: DC14


DD Naming convention

Structure:	“DD N/V”
2k Description Structure:	“DD N/e Pitch”

Eg: DD3/A


DIP Naming convention

For PMD

Structure	“DIP N/ Width/V”
2k Description Structure:	“DIP N/e Pitch/W Width”

Includes all DIL, DIP, SDIP, PDIP, MDIP, CDIP, Hermetic DIP, Zigzag DIP
Eg: DIP16/300, DIP16/300/A, DIP16/300/P12

For SMD

Structure	“DIP N/Width/SM/V”
2k Description Structure:	“DIP N/e Pitch/W Width/SM”

Eg: DIP8/300/SM


DO Naming Convention

Structure:	“DO# /N/L Length/V”
2k Description Structure:	“DO# /N/L Length”

Eg: DO13/2/L700


FP Naming Convention

Structure	“FP N/Width/V”
2k Description Structure:	“FP N/e Pitch/W width”

 Eg: FP48/380


Fuse Naming Convention

For PMD

Structure for Fuse:	“F/L length/V”
2k Description Structure:	“F/L length/H Hole Diameter”

 Eg: F/L1500

For SMD

Structure for Fuse:	“F/L length/SM/V”
2k Description Structure:	“F/L length/S Pad Size

Eg: F/L200/SM.


Inductor Naming Convention

For PMD

Structure for Inductor:	“L/L length/V”
2k Description Structure:	“L/L length/H Hole Diameter”

 Eg: L/L600

For SMD

Structure for Inductor:	“L/L length/SM/V”
2k Description Structure:	“L/L length/S Pad Size”

Eg: L/L79/SM


LCC Naming Convention

Structure:	“LCC N/V”
2k Description Structure:	“LCC N/e Pitch”

Include all CLCC, LCC, PLCC series.
Eg: LCC18, LCC18/A, LCC20


LGA Naming Convention

Structure:	“LGA N/M Matrix/V”
2k Description Structure:	“LGA N/e Pitch/M Matrix”

Eg: LGA227/M22x22


PGA Naming Convention

Structure:	“PGA N/M Matrix/V”
2k Description Structure:	“PGA N/e Pitch/M Matrix”

Eg: PGA68/M10x10, PGA68/M11x11


QFP Naming Convention

Structure:	“QFP N/V”
2k Description Structure:	“QFP N/e Pitch”

Include all CQFP, PQFP, QFP, TQFP Series.
Eg: QFP144, QFP144/A, QFP132.


Relay Naming Convention

Structure:	“RELAY N/V”
2k Description Structure:	“RELAY N/e Pitch/H Hole diameter”

Eg: RELAY6, RELAY5


Resistor Naming Convention

For PMD

Structure for Fixed Resistor:	“R/L length/V”
2k Description Structure:	“R/L length/H Hole Diameter”

  Eg: R/L600, R/L400, R/L400/A

Structure for Variable Resistor:	“RVAR N/V”
2k Description Structure:	“RVAR N/H Hole diameter”

Eg: RVAR3, RVAR3/A

For SMD

Structure for Fixed Resistor:	“R/L length/SM/V”
2k Description Structure:	“R/L length/S Pad Size”

Eg: R/L90/SM

Structure for Variable Resistor:	“RVAR N/SM/V”
2k Description Structure:	“RVAR N/S Pad Size”

Eg: RVAR3/SM


SIP Naming Convention

Structure:	“SIP N/V”
2k Description Structure:	“SIP N/e Pitch”

 Includes all SIP and SIL series
Eg: SIP10, SIP8

Structure for SIP Discrete:	“SIP N/DS/V”
2k Description Structure:	“SIP N/e Pitch/DS”

 Eg: SIP10/DS, SIP11/DS


Socket Naming convention

General Structure:	“SKT/Type N/V”
Structure DIP Socket	“SKT/DIP N/Width/V”
2k Description Structure:	“SKT/DIP N/e Pitch/W Width”

Eg: SKT/DIP4/300, SKT/DIP6/300

Structure DIMM Socket:	“SKT/DIMM N/V”
2k Description Structure:	“SKT/DIMM N/e Pitch”

Eg: SKT/DIMM144/e80m


SOJ Naming Convention

Structure:	“SOJ N/Width/V”
2k Description Structure:	“SOJ N/e Pitch/W Width”

 Eg: SOJ20/200, SOJ26/350/P20


SOIC Naming convention

Structure:	“SOIC N/Width/V”
2k Description Structure:	“SOIC N/e Pitch/W Width”

Eg: SOIC32/300, SOIC28/300/P8


SOP Naming Convention

Structure:	“SOP N/Width/V”
2k Description Structure:	“SOP N/e Pitch/W width”

Includes all SOP, SSOP, TSOP, MSOP, VSOP
Eg: SOP16/200, SOP16/150


SOT Naming convention

Structure:	“SOT# /N/V”
2k Description Structure:	“SOT# /N/e Pitch”

Eg: SOT82/3


Transformer Naming Convention

For PMD

Structure for Transformer:	“TFR N/V”
2k Description Structure:	“TFR N/H Hole Diameter/”

Eg: TFR6, TFR6/A

For SMD

Structure for Transformer:	“TFR N/SM/V”
2k Description Structure:	“TFR N/S Pad Size/V”

Eg: TFR6/SM.


TO Naming convention

Structure:	“TO# /N/V”
2k Description Structure:	“TO# /N/e Pitch”

Eg: TO100/10, TO126/3


ZIP Naming Convention

Structure:	“ZIPN/V”
2k Description Structure:	“ZIPN/e Pitch”

Eg: ZIP16, ZIP20.


Miscellaneous Packages

Structure:	“PMD N/V” “SMD N/V”
2k Description Structure:	“PMD N/e Pitch/V” “SMD N/e Pitch/V”

Eg: PMD113


Keyword Description

#	- The standard number after the package name, eg: TO220, TO3, DO5 etc.
DS	- Discrete.
e	- Denotes the pitch in mils, if it is in millimeter suffix „m‟ needs
H	- Hole diameter.
L	- Distance between pins in discrete components.
M	- Indicates the Matrix in PGA, BGA, and LGA series.
N	- Total number of pins.
P	- Indicates the number of existing pins .
POL	- Polarized.
S	- Used for indicating the pad size of SMD in the form „X-LENGTH x Y-LENGTH‟.
SM	- Surface Mount
V	- Variations
W	- Width of Package (body width of the IC).

Appendix - A

For same non-discrete packages which comes both in PMD and SMD (eg: DIP, R, C, L etc.), add „SM‟ in the SMD name before variations.

Appendix - B

If some pins are omitted in the package, we will put a prefix P (capital letter P) and number of existing pins in the package before variations.
Eg: SOIC28/P8

Appendix -C

Variation means any alternation in the package with respect to the Basic Package* of that category, for example change in shape or number orientation, to be named as the name of Basic package followed by a suffix with Variations** starting from A to Z.

Basic Package*
Normally we will fix the first package, which is available in a particular category as the Basic Package. Any deviations from this package in later creation can be in dicate by using Variations** etc.
Basic Package Name can be defined by an example. Consider 300 mil wide DIP14 (EDWin suggested Name: DIP14/300). For this package pin no. is 14 and width of Package is 300 mils. So we will name this as DIP14/300 and assume it as the basic package. If a new DIP package in 14 pin comes but with a change from the package we have already created, say in shape or pin orientation, we will name it as „DIP14/300/A‟ where A is the variation.

**The following letters are excluded from Variation list: - I,O

Glossary

Matrix - The number of rows and columns in grid arrays in the form „ROW x COLUMN‟. Pitch- Pin to pin spacing.

BGA	-Ball Grid Array
CDIP	- Ceramic Dual In Line Package
CLCC	- Ceramic Leaded / Lead less Chip Carrier
CQFP	- Ceramic Quad Flat Package
DIL	-Dual In Line Package
DIP	-Dual In Line Package
DO	-Diode Outline
LCC	-Leaded / Lead less Chip Carrier
LGA	-Land Grid Array
MDIP	-Molded Dual In Line Package
MSOP	-Molded Small Outline Package
PDIP	-Plastic Dual In Line Package
PGA	-Pin Grid Array
PLCC	-Plastic Leaded / Lead less Chip Carrier
PQFP	-Plastic Quad Flat Package
QFP	-Quad Flat Package
SDIP	-Side Brazed Dual In Line Package
SIL	-Single In Line Package
SIP	-Single In Line Package
SOIC	-Small Outline Integrated Circuit
SOJ	-Small Outline J-Lead
SOP	-Small Outline Package
SOT	-Small Outline Transistor
SSOP	-Shrinked Small Outline Package
TO	-Transistor Outline
TQFP	-Thin Quad Flat Package
TSOP	-Thin Small Outline Package
TSSOP	-Small Shrinked Outline Package
VSOP	-Very Small Outline Package
ZDIP	-Zigzag Dual In Line Package
ZIP	-Zigzag In Line Package