BGA (Ball Grid Array) Packages are created in EDWinXP from Package Editor of EDWinXP
Procedure
Evoke EDWinXP: Start → Programs → EDWinXP → EDWinXP Main
Open Package Editor: Right click Library and choose Library Editor.
Package Creation Wizard: FileNew → Package Using Wizard
Set the Package Name as BGA192/M19x19 and Package type as Grid Array (PGA,BGA,..)as shown in the below screen shot
Here 192 denote number of pins in this package and 19x19 denotes the Pin Matrix of the package.
Click Next tab to continue.
In the Window, fill the required parameters as in given below example:
| No. of pins | 192 |
| Pin to pin Distance | 1.27mm |
| Horizontal pitch between pads | 1.27mm |
| Length of Package outline | 25mm |
| Width Package outline | 25mm |
| No.of Bottom Row Pins | 19 |
| Package Description | BGA 192/e 50/M 19x19 |
Padstack is selected by double clicking on the field Default Padstack.
From the drop down menu select suitable smd padstack. Click on Edit or create new Padstack to Make necessary changes to the padstack’s shape and size and click
Make button
Click on Accept selection button, then automatically the padstack selected will be assigned as the Default Padstack
The resulting Screenshot is as shown below.
Double Click Package Type field to select a Package Type. The window for selecting the package type is displayed. From the drop down menu select SMD → BGA and Click Accept as shown in below screen shot.
Click Next to continue to the next Step to show the details of the created padstacks as shown in the below screen shot.
Click Next to proceed to the next step. In this step make necessary arrangements like Width, Length and Offset values in X, Y Directions and to get the package preview
Click Next to proceed. The final window shows the details of the created Package as shown below and click Finish to finish creation.
Save the created package: From the File Menu choose Save Package As BGA192/M19x19